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FEATURES
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LT3782 2-Phase Step-UP DC/DC Controller DESCRIPTION
The LT(R)3782 is a current mode two phase step-up DC/DC converter controller. Its high switching frequency (up to 500kHz) and 2-phase operation reduce system filtering capacitance and inductance requirements. With 10V gate drive (VCC 13V) and 4A peak drive current, the LT3782 can drive most industrial grade high power MOSFETs with high efficiency. For synchronous applications, the LT3782 provides synchronous gate signals with programmable falling edge delay to avoid cross conduction when using external MOSFET drivers. Other features include programmable undervoltage lockout, soft-start, current limit, duty cycle clamp (50% or higher) and slope compensation. The LT3782 is available in thermally enhanced 28-lead TSSOP and 4mm x 5mm QFN packages.
, LT, LTC and LTM are registered trademarks of Linear Technology Corporation. All other trademarks are the property of their respective owners. Protected by U.S. Patents, including 6144194.
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2-Phase Operation Reduces Required Input and Output Capacitance Programmable Switching Frequency: 150kHz to 500kHz 6V to 40V Input Range 10V Gate Drive with VCC 13V High Current Gate Drive (4A) Programmable Soft-Start and Current Limit Programmable Slope Compensation for High Noise Immunity MOSFET Gate Signals with Programmable Falling Edge Delay for External Synchronous Drivers Programmable Undervoltage Lockout Programmable Duty Cycle Clamp (50% or Higher) Thermally Enhanced 28-Lead TSSOP and 4mm x 5mm QFN Packages
APPLICATIONS
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Industrial Equipment Telecom Infrastructure Interleaved Isolated Power Supply
TYPICAL APPLICATION
50V 4A Boost Converter
VIN 10V TO 36V R6 825k CIN 10F 50V 2x R8 274k 1F RUN L1 VCC GBIAS1 GBIAS2 GBIAS BGATE1 RS1 0.004 VEE1 SLOPE DELAY RFREQ 80k DCL RSET SS 0.1F VC 13k 100pF 6.8nF VEE2 10 SENSE1+ SENSE1- SENSE2 SENSE2- FB GND
+
D1 30BQ060 D2 30BQ060
+
C3 2F
L2 M1 Si7852dp 2x
COUT1 10F 50V 2x
VOUT 50V, 4A
+
Efficiency and Power Loss vs Load Current
97 EFFICIENCY 95 VIN = 12V
POWER LOSS (W) EFFICIENCY (%)
COUT2 220F
18 VIN = 24V 15 12 VIN = 12V VIN = 24V POWER LOSS 9 6 3 0
LT3782 RSLOPE 59k
93 91 89 87 85
BGATE2
M2 Si7852dp 2x RS2 0.004 10
L1, L2: PB2020.223 CIN, COUT1: X7R, TDK
0
1
2
10nF
10nF RF1 475k
3 IOUT (A)
4
5
3782 TA01b
3782 TA01
RF2 24.9k
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LT3782 ABSOLUTE MAXIMUM RATINGS
(Note 1)
VCC Supply Voltage ...................................................40V GBIAS, GBIAS1, GBIAS2 Pin (Externally Forced) ....................................................14V SYNC, RUN Pin .........................................................30V Operating Junction Temperature Range (Notes 2, 3) ................................. -40C to 125C
Storage Temperature Range...................- 65C to 150C Lead Temperature (Soldering, 10 sec) .................. 300C SS ................................................................ -0.3V to 6V SENSE1+, SENSE2+, SENSE1-, SENSE2- ..................................... -0.3V to 2V
PIN CONFIGURATION
TOP VIEW
TOP VIEW
SGATE1
SGATE2
GBIAS
SGATE2 SGATE1 NC GND SYNC DELAY DCL SENSE1+ SENSE1
-
1 2 3 4 5 6 7 8 9 29
28 GBIAS
27 VCC 26 NC 25 NC 24 VEE1 23 BGATE1 22 GBIAS1 21 GBIAS2 20 BGATE2 19 VEE2 18 NC 17 RUN 16 FB 15 VC
28 27 26 25 24 23 SYNC 1 DELAY 2 DCL 3 SENSE1+ 4 SENSE1- 5 SLOPE 6 RSET 7 SENSE2- 8 9 10 11 12 13 14 29 22 BGATE1 21 GBIAS1 20 NC 19 NC 18 GBIAS2 17 BGATE2 16 VEE2 15 NC
SLOPE 10 RSET 11 SENSE2
-
SENSE2+
SENSE2+ 13 SS 14
FE PACKAGE 28-LEAD PLASTIC TSSOP TJMAX = 125C, JA = 38C/ W EXPOSED PAD (PIN 29) IS GND, MUST BE SOLDERED TO PCB
UFD PACKAGE 28-LEAD (4mm x 5mm) PLASTIC QFN TJMAX = 125C, JA = 37C/ W EXPOSED PAD (PIN 29) IS GND, MUST BE SOLDERED TO PCB
ORDER INFORMATION
LEAD FREE FINISH LT3782EFE#PBF LT3782IFE#PBF LT3782EUFD#PBF LEAD BASED FINISH LT3782EFE LT3782IFE LT3782EUFD TAPE AND REEL LT3782EFE#TRPBF LT3782IFE#TRPBF LT3782EUFD#TRPBF TAPE AND REEL LT3782EFE#TR LT3782IFE#TR LT3782EUFD#TR PART MARKING LT3782EFE LT3782IFE 3782 PART MARKING LT3782EFE LT3782IFE 3782 PACKAGE DESCRIPTION 28-Lead Plastic TSSOP 28-Lead Plastic TSSOP 28-Lead (4mm x 5mm) Plastic QFN PACKAGE DESCRIPTION 28-Lead Plastic SSOP 28-Lead Plastic SSOP 28-Lead (4mm x 5mm) Plastic QFN TEMPERATURE RANGE -40C to 85C -40C to 125C -40C to 85C TEMPERATURE RANGE -40C to 85C -40C to 125C -40C to 85C
Consult LTC Marketing for parts specified with wider operating temperature ranges. For more information on lead free part marking, go to: http://www.linear.com/leadfree/ For more information on tape and reel specifications, go to: http://www.linear.com/tapeandreel/
RUN
NC
SS
VC
FB
12
VEE1
GND
VCC
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LT3782
The denotes the specifications which apply over the full operating junction temperature range, otherwise specifications are at TA = 25C. VCC = 13V, RSET = 80k, no load on any outputs, unless otherwise noted.
PARAMETER Overall Supply Voltage (VCC) Supply Current (IVCC) Shutdown RUN Threshold RUN Threshold Hysteresis Supply Current in Shutdown RUN Pin Input Current Voltage Amplifier gm Reference Voltage (VREF) Transconductance Input Current IFB VC High VC Low Source Current IVC Sink Current IVC VC Threshold for Switching Off (BGATE1, BGATE2 Low) Soft-Start Current ISS Current Amplifier CA1, CA2 Voltage Gain VC /VSENSE Current Limit (VSENSE1+ - VSENSE1-) (VSENSE2+ - VSENSE2-) Input Current (ISENSE1+, ISENSE1-, ISENSE2+, ISENSE2-) Oscillator Switching Frequency RSET = 130k RSET = 80k RSET = 40k Rising Edge VSYNC RSET = 130k RSET = 80k RSET = 40k RSET = 80k VFB = VREF - 25mV, RSET > 80k RSET = 40k RSET = 80k, VDCL 0.3V VDCL = 1.2V VDCL = VRSET VDCL 0.3V
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ELECTRICAL CHARACTERISTICS
CONDITIONS
MIN 6
TYP
MAX 40
UNITS V mA V mV mA A A V V mho A V V A A V A
VC 0.5V (Switching Off), VCC 40V 2.3
11 2.45 80 0.4 40
l
16 2.6 0.65 90 -2 2.464 2.488 370 0.6 0.4 14 28 15
1V RUN VREF, VCC 30V RUN 0.3V, VCC 30V VRUN = 2.3V
-0.5 2.42 2.4 200 2.44 260 0.2 1.5 0.35 8 13 11 20 10 4 50 62 60 130 212 386 0.8 180 290 550 2.3 90 83 94 90 50 75 Max Duty Cycle -0.1 154 250 465 1.2
VVC = 1V, IVC = 2A VFB = VREF IVC = 0 IVC = 0 VVC = 0.7V - 1V, VFB = VREF - 100mV VVC = 0.7V - 1V, VFB = VREF + 100mV
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0.3 6
VSS = 0.1V - 2.8V
80
mV A
VSENSE = 0V
177 288 533 2 240 392 715
kHz kHz kHz V kHz kHz kHz V % % % %
Synchronization Pulse Threshold on SYNC Pin Synchronization Frequency Range (Note: Operation Switching Frequency Equals Half of the Synchronization Frequency) VRSET Maximum Duty Cycle Duty Cycle Limit
DCL Pin Input Current
-0.3
A
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LT3782
The denotes the specifications which apply over the full operating junction temperature range, otherwise specifications are at TA = 25C. VCC = 13V, RSET = 80k, no load on any outputs, unless otherwise noted.
PARAMETER Gate Driver VGBIAS BGATE1, BGATE2 High Voltage BGATE1, BGATE2 Source Current (Peak) BGATE1, BGATE2 Low Voltage BGATE1, BGATE2 Sink Current (Peak) SGATE1, SGATE2 High Voltage SGATE1, SGATE2 Low Voltage SGATE1, SGATE2 Peak Current Delay of BGATE High IGBIAS < 70mA 13V VCC 24V, IBGATE = -100mA VCC = 8V, IBGATE = -100mA Capacitive Load >22F Capacitive Load >50F 8V VCC 24V, IBGATE = 100mA Capacitive Load >22F Capacitive Load >50F 8V VCC 24V, ISGATE = -20mA 8V VCC 24V, ISGATE = 20mA 500pF Load DELAY Pin and RSET Pin Shorted VDELAY = 1V VDELAY = 0.5V VDELAY = 0.25V VDELAY = 0.25V
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ELECTRICAL CHARACTERISTICS
CONDITIONS
MIN 10.2 7.8 3.8
TYP 11 9.2 5 3 4 0.5 3 4
MAX 11.7 10.5
UNITS V V V A A
0.7
V A A
4.5
5.5 0.5 100 100 150 250 500 -0.1
6.7 0.7
V V mA ns ns ns ns
Delay Pin Input Current
-0.3
A
Note 1: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to any Absolute Maximum Rating condition for extended periods may affect device reliability and lifetime. Note 2: The LT3782E is guaranteed to meet performance specifications from 0C to 85C. Specifications over the -40C to 125C operating junction temperature range are assured by design, characterization and correlation with statistical process controls. The LT3782I is guaranteed to
meet performance specifications over the full -40C to 125C operating junction temperature range. Note 3: This IC includes overtemperature protection that is intended to protect the device during momentary overload conditions. Junction temperature will exceed 125C when overtemperature protection is active. Continuous operation above the specified maximum operating junction temperature may impair device reliability.
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LT3782 TYPICAL PERFORMANCE CHARACTERISTICS
VGBIAS vs IGBIAS
11.0 10.9 10.8 10.7 VGBIAS (V)
TA = 25C unless otherwise noted. VREF vs VCC, Frequency vs VCC (RSET = 80k)
3 2 1
VREF (mV)
ICC vs VCC
20 18 16 14
12 10 8 VREF 6 4 Frequency 2 0 -2 -4 6 9 12 15 18 VCC (V)
3782 G03
FREQUENCY (kHz)
10.5 10.4 10.3 10.2 10.1 10.0 0 50 IGBIAS (mA)
3782 G01
ICC (mA)
10.6
12 10 8 6 4 2
0 -1 -2 -3 -4 -5
100
0
6
8 10 12 14 16 18 20 22 24 26 28 30 VCC (V)
3782 G02
21
24
27
30
Switching Frequency vs RFREQ
600
Reference Voltage vs Temperature
2.446 2.444
REFERENCE VOLTAGE (V)
VGBIAS vs IGBIAS at Start-Up (Charging 2F)
14 12 10 VGBIAS 800 700 600 500 400 300 IGBIAS 2 200 100 0 250 500 TIME (s) 750 0 1m
3782 G06
500
FREQUENCY (kHz)
2.442
VGBIAS (V)
400
8 6 4
IGBIAS (mA)
2.440 2.438 2.436 2.434 0 25 75 100 125 50 JUNCTION TEMPERATURE (C) 150
3782 G05
300
200
0 -2
100
0
20 40 60 80 100 120 140 160 180 200 RFREQ (k)
3782 G04
SGATE (Low) to BGATE (High) Delay vs VDELAY (RSET = 80k)
1000 900 800 105
Switching Frequency vs Duty Cycle
120 110
MAXIMUM DUTY CYCLE (%)
Maximum Duty Cycle Limit vs VDCL (RSET = 80k)
100
100 90 80 70 60 50
DUTY CYCLE (%)
700
DELAY (ns)
600 500 400 300 200 100 0 0 0.5 1.5 1.0 VDELAY (V) 2.0 2.5
3782 G07
95
90
85
80 100
40 200 400 500 300 SWITCHING FREQUENCY (kHz) 600
3782 G08
0
0.3
0.6
0.9
1.2 1.5 VDCL (V)
1.8
2.1
2.4
3782 G09
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LT3782 PIN FUNCTIONS
(FE/UFD)
SGATE2 (Pin 1/Pin 26): Second Phase Synchronous Drive Signal. An external driver buffer is needed to drive the top synchronous power FET. SGATE1 (Pin 2/Pin 27): First Phase Synchronous Drive Signal. An external driver buffer is needed to drive the top synchronous power FET. GND (Pin 4/Pin 28): Chip Ground. SYNC (Pin 5/Pin 1): Synchronization Input. The pulse width can range from 10% to 70%. Note that the operating frequency is half of the sync frequency. DELAY (Pin 6/Pin 2): When synchronous drivers are used, the programmable delay that delays BGATE turns on after SGATE turns off. DCL (Pin 7/Pin 3): This pin programs the limit of the maximum duty cycle. When connected to VRSET, it operates at natural maximum duty cycle, approximately 90%. SENSE1+ (Pin 8/Pin 4): First Phase Current Sense Amplifier Positive Input. An RC filter is required across the current sense resistor. Current limit threshold is set at 60mV. SENSE1- (Pin 9/Pin 5): First Phase Current Sense Amplifier Negative Input. An RC filter is required across the current sense resistor. SLOPE (Pin 10/Pin 6): A resistor from SLOPE to GND increases the internal current mode PWM slope compensation. RSET (Pin 11/Pin 7): A resistor from RSET to GND sets the oscillator charging current and the operating frequency. SENSE2- (Pin 12/Pin 8): Second Phase Current Sense Amplifier Negative Input. An RC filter is required across the current sense resistor. SENSE2+ (Pin 13/Pin 10): Second Phase Current Sense Amplifier Positive Input. An RC filter is required across the current sense resistor. Current limit threshold is set at 60mV. SS (Pin 14/Pin 11): Soft-Start. A capacitor on this pin sets the output ramp up rate. The typical time for SS to reach the programmed level is (C * 2.44V)/10A.
VC (Pin 15/Pin 12): The output of the gm error amplifier and the control signal of the current loop of the current-mode PWM. Switching starts at 0.7V, and higher VC voltages corresponds to higher inductor current. FB (Pin 16/Pin 13): Error Amplifier Inverting Input. A resistor divider to this pin sets the output voltage. RUN (Pin 17/Pin 14): LT3782 goes into shutdown mode when VRUN is below 2.2V and goes to low bias current shutdown mode when VRUN is below 0.3V. VEE2 (Pin 19/Pin 16): Gate Driver BGATE2 Ground. This pin should be connected to the ground side of the second current sense resistor. BGATE2 (Pin 20/Pin 17): Second Phase MOSFET Driver. GBIAS2 (Pin 21/Pin 18): Bias for Gate Driver BGATE2. Should be connected to GBIAS or an external power supply between 12V to 14V. A bypass low ESR capacitor of 2F or larger is needed and should be connected directly to the pin to minimize parasitic impedance. GBIAS1 (Pin 22/Pin 21): Bias for Gate Driver BGATE1. Should be connected to GBIAS2. BGATE1 (Pin 23/Pin 22): First Phase MOSFET Driver. VEE1 (Pin 24/Pin 23): Gate Driver BGATE1 Ground. This pin should be connected to the ground side of the second current sense resistor. VCC (Pin 27/Pin 24): Chip Power Supply. Good supply bypassing is required. GBIAS (Pin 28/Pin 25): Internal 11V regulator output for biasing internal circuitry. Should be connected to GBIAS1 and GBIAS2. Exposed Pad (Pin 29/Pin 29): The exposed package pad is fused to internal ground and is for heat sinking. Solder the bottom metal plate onto expanded ground plane for optimum thermal performance. NC (Pins 3, 18, 25, 26/Pins 9, 15, 19, 20): Not Connected. Can be connected to GND.
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LT3782 BLOCK DIAGRAM
VIN CIN 20F VCC 27 REGULATOR VGBIAS = VCC - 1V AND CLAMPED AT 11V L1 15 GBIAS1 L2 15 C3 2F VOUT D1 D2
+
R6 RUN 17 R8 0.5V A5
LOW POWER SHUTDOWN
+
A11 A8
+ -+
A6 VCC - 2.5V
+
22 GBIAS2 21 GBIAS 28
COUT 100F
+
-
7V
+
-
RF1 RF2
+
A7
+
2.44V
-
A4
A20 SGATE1 A1 ONE SHOT A12 BGATE1 2 DELAY 6 RSET
+
2.5V
+ -
A13 SLOPE COMP CH1 A14
GBIAS1 BGATE1 A9 23 R1 50k 8 BLANKING R3 9 VEE1 24 SENSE1- C2 2nF M1
SENSE1+
R7 10
RS1
PWM1
+ -
A3
+
BGATE1 SGATE1 SET A15 A17 1 DELAY CL1
-+
60mV SGATE2
+
2.5V BGATE2
+
A16
-
DELAY
ONE SHOT GBIAS2 A18 SLOPE COMP SET SLOPE 10 SYNC 5 RSET 11 RFREQ C5 20pF GND 4 60mV VC OSC CK D Q Q LOGIC CL2 A10 D6 SLOPE COMP CH1 S R CH2 S R PWM2 CH2 BGATE2 A19 A2 20 R2 50k 13 BLANKING R4 12 VEE2 19 FB 16 D7
3782 BD
M2
SENSE2+ SENSE2-
R9 10 C4 2nF
RS2
+ -
+
GM
- +
D4 SS R5 2k C1 2000pF I1 10A 4V 14 C7 10nF VREF
+
-
NOTE: PACKAGE BOTTOM METAL PLATE (PIN 29) IS FUSED TO CHIP DIE AGND
7 DCL
15
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LT3782 APPLICATIONS INFORMATION
Operation The LT3782 is a two phase constant frequency current mode boost controller. Switching frequency can be programmed up to 500kHz. During normal switching cycles, the two channels are controlled by internal flip-flops and are 180 degrees out-of-phase. Referring to the Block Diagram, the LT3782's basic functions include a transconductance amplifer (gm) to regulate the output voltage and to control the current mode PWM current loop. It also includes the necessary logic and flipflop to control the PWM switching cycles, two high speed gate drivers to drive high power N-Channel MOSFETs, and 2-phase control signals to drive external gate drivers for optional synchronous operation. In normal operation, each switching cycle starts with a switch turn-on. The inductor current of each channel is sampled through the current sense resistor and amplified then compared to the error amplifier output VC to turn the switch off. The phase delay of the second channel is controlled by the divide-by-two D flip-flop and is exactly 180 degrees out-of-phase of the first channel. With a resistor divider connected to the FB pin, the output voltage is programmed to the desired value. The 10V gate drivers are sufficient to drive most high power N-channel MOSFET in many industrial applications. Additional important features include shutdown, current limit, soft-start, synchronization and programmable maximum duty cycle. Additional slope compensation can be added also. Output Voltage Programming With a 2.44V feedback reference voltage VREF, the output VOUT is programmed by a resistor divider as shown in the Block Diagram. VOUT = 2.44 1+ RF1 RF2 Soft-Start and Shutdown During soft-start, the voltage on the SS pin (VSS) controls the output voltage. The output voltage thus ramps up following VSS. The effective range of VSS is from 0V to 2.44V. The typical time for the output to reach the programmed level is t= C * 2.44V 10A
C is the capacitor connected from the SS pin to Gnd. Undervoltage Lockout and Shutdown Only when VRUN is higher than 2.45V VGBIAS will be active and the switching enabled. The LT3782 goes into low current shutdown when VRUN is below 0.3V. A resistor divider can be used on RUN pin to set the desired VCC undervoltage lockout voltage. 80mV of hysteresis is built in on RUN pin thresholds. Oscillation Frequency Setting and Synchronization The switching frequency of LT3782 can be set up to 500kHz by a resistor RFREQ from pin RSET to ground. For fSET = 250kHz, RFREQ = 80k Once the switching frequency fSET is chosen, RFREQ can be found from the Switching Frequency vs RFREQ graph found under the Typical Performance Characteristics section. Note that because of the 2-phase operation, the internal oscillator is running at twice the switching frequency. To synchronize the LT3782 to the system frequency fSYSTEM, the synchronizing frequency fSYNC should be two times fSYSTEM, and the LT3782 switching frequency fSET should be set below 80% of fSYSTEM. fSYNC = 2fSYSTEM and fSET < (fSYSTEM * 0.8) For example, to synchronize the LT3782 to 200kHz system frequency fSYSTEM, fSYNC needs to be set at 400kHz and fSET needs to be set at 160kHz. From the Switching Frequency vs RFREQ graph found under the Typical Performance Characteristics section, RFREQ = 130k.
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LT3782 APPLICATIONS INFORMATION
With a 200ns one-shot timer on chip, the LT3782 provides flexibility on the external sync pulse width. The sync pulse threshold is about 1.2V (Figure 1). Current Limit Current limit is set by the 60mV threshold across SEN1P , SEN1N for channel one and SEN2P SEN2N for channel , two. By connecting an external resistor RS (see Block Diagram), the current limit is set for 60mV/RS. RS should be placed very close to the power switch with very short traces. A low pass RC filter is needed across RS to filter out the switching spikes. Good Kelvin sensing is required for accurate current limit. The input bypass capacitor ground should be at the same ground point of the current sense resistor to minimize the ground current path. Synchronous Rectifier Switches For high output voltage applications, the power loss of the catch diodes are relatively small because of high duty cycle. If diodes power loss or heat is a concern, the LT3782 provides PWM signals through SGATE1 and SGATE2 pins to drive external MOSFET drivers for synchronous rectifier operation. Note that SGATE drives the top switch and BGATE drives the bottom switch. To avoid cross conduction between top and bottom switches, the BGATE turn-on is delayed 100ns (when DELAY pin is tied to RSET pin) from SGATE turn-off (see Figure 2). If a longer delay is needed to compensate for the propagation delay of external gate driver, a resistor divider can be used from RSET to ground to program VDELAY for the longer delay needed. For example, for a switching frequency of 250kHz and delay of 150ns,
5V TO 20V 5k SYNC VN2222 PULSE WIDTH > 200ns
3782 F01
LT3782
Figure 1. Synchronizing with External Clock
BGATE1 SGATE1 SET
3782 F02
DELAY
Figure 2. Delay Timing
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LT3782 APPLICATIONS INFORMATION
then RFREQ1 + RFREQ2 should be 80k and VDELAY should be 1V, with VRSET = 2.3V then RFREQ1 = 47.5k and RFREQ2 = 32.5k (see Figure 3). Duty Cycle Limit When DCL pin is shorted to RSET pin and switching frequency is less than 250kHz (RFREQ > 80k), the maximum duty cycle of LT3782 will be at least 90%. The maximum duty cycle can be clamped to 50% by grounding the DCL pin or to 75% by forcing the VDCL voltage to 1.2V with a resistor divider from RSET pin to ground. The typical DCL pin input current is 0.2A. Slope Compensation The LT3782 is designed for high voltage and/or high current applications, and very often these applications generate noise spikes that can be picked up by the current sensing amplifier and cause switching jitter. To avoid switching jitter, careful layout is absolutely necessary to minimize the current sensing noise pickup. Sometimes increasing slope compensation to overcome the noise can help to reduce jitter. The built-in slope compensation can be increased by adding a resistor RSLOPE from SLOPE pin to ground. Note that smaller RSLOPE increases slope compensation and the minimum RSLOPE allowed is RFREQ/2. Layout Considerations To prevent EMI, the power MOSFETs and input bypass capacitor leads should be kept as short as possible. A ground plane should be used under the switching circuitry to prevent interplane coupling and to act as a thermal spreading path. Note that the bottom pad of the package is the heat sink, as well as the IC signal ground, and must be soldered to the ground plane. In a boost converter, the conversion gain (assuming 100% efficiency) is calculated as (ignoring the forward voltage drop of the boost diode): VOUT 1 = VIN 1-D where D is the duty ratio of the main switch. D can then be estimated from the input and output voltages: D=1- V VIN ; DMAX =1- IN(MIN) VOUT VOUT
DELAY LT3782 RSET RFREQ1 47.5k RFREQ2 32.5k
3782 F03
Figure 3. Increase Delay Time
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LT3782 APPLICATIONS INFORMATION
The Peak and Average Input Currents The control circuit in the LT3782 measures the input current by using a sense resistor in each MOSFET source, so the output current needs to be reflected back to the input in order to dimension the power MOSFET properly. Based on the fact that, ideally, the output power is equal to the input power, the maximum average input current is: I IIN(MAX) = O(MAX) 1- DMAX The peak current is: I IIN(PEAK) =1.2 * O(MAX) 1- DMAX The maximum duty cycle, DMAX, should be calculated at minimum VIN. Power Inductor Selection In a boost circuit, a power inductor should be designed to carry the maximum input DC current. The inductance should be small enough to generate enough ripple current to provide adequate signal to noise ratio to the LT3782. An empirical starting of the inductor ripple current (per phase) is about 40% of maximum DC current, which is half of the input DC current in a 2-phase circuit: IL 40% * IOUT(MAX) * VOUT 2VIN = 20% * IOUT(MAX) * VOUT VIN And the inductance is estimated to be: L= VIN * D fs * IL
where fs is the switching frequency per phase. The saturation current level of inductor is estimated to be: ISAT *V I IL IIN + 70% * OUT(MAX) OUT 2 2 VIN(MIN)
Sense Resistor Selection During the switch on-time, the control circuit limits the maximum voltage drop across the sense resistor to about 60mV. The peak inductor current is therefore limited to 60mV/R. The relationship between the maximum load current, duty cycle and the sense resistor RSENSE is: 1- DMAX R VSENSE(MAX) * I 1.2 * O(MAX) 2 Power MOSFET Selection Important parameters for the power MOSFET include the drain-to-source breakdown voltage (BVDSS), the threshold voltage (VGS(TH)), the on-resistance (RDS(ON)) versus gateto-source voltage, the gate-to-source and gate-to-drain charges (QGS and QGD, respectively), the maximum drain current (ID(MAX)) and the MOSFET's thermal resistances (RTH(JC) and RTH(JA)).
where VIN, VOUT and IOUT are the DC input voltage, output voltage and output current, respectively.
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LT3782 APPLICATIONS INFORMATION
The gate drive voltage is set by the 10V GBIAS regulator. Consequently, 10V rated MOSFETs are required in most high voltage LT3782 applications. Pay close attention to the BVDSS specifications for the MOSFETs relative to the maximum actual switch voltage in the application. The switch node can ring during the turn-off of the MOSFET due to layout parasitics. Check the switching waveforms of the MOSFET directly across the drain and source terminals using the actual PC board layout (not just on a lab breadboard!) for excessive ringing. Calculating Power MOSFET Switching and Conduction Losses and Junction Temperatures In order to calculate the junction temperature of the power MOSFET, the power dissipated by the device must be known. This power dissipation is a function of the duty cycle, the load current and the junction temperature itself (due to the positive temperature coefficient of its RDS(ON)). As a result, some iterative calculation is normally required to determine a reasonably accurate value. Care should be taken to ensure that the converter is capable of delivering the required load current over all operating conditions (line voltage and temperature), and for the worst-case specifications for VSENSE(MAX) and the RDS(ON) of the MOSFET listed in the manufacturer's data sheet. The power dissipated by the MOSFET in a 2-phase boost converter is: IO(MAX) PFET = 2
2
(1- D)
* RDS(ON) * D * IO(MAX)
T
+k * VO2 *
2
(1- D)
* CRSS * f
The first term in the equation above represents the I2R losses in the device, and the second term, the switching losses. The constant, k = 1.7, is an empirical factor inversely related to the gate drive current and has the dimension of 1/current. The T term accounts for the temperature coefficient of the RDS(ON) of the MOSFET, which is typically 0.4%/C. Figure 4 illustrates the variation of normalized RDS(ON) over temperature for a typical power MOSFET.
2.0
T NORMALIZED ON RESISTANCE
1.5
1.0
0.5
0 -50
50 100 0 JUNCTION TEMPERATURE (C)
150
3782 F06
Figure 4. Normalized RDS(ON) vs Temperature
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LT3782 APPLICATIONS INFORMATION
From a known power dissipated in the power MOSFET, its junction temperature can be obtained using the following formula: TJ = TA + PFET * RTH(JA) The RTH(JA) to be used in this equation normally includes the RTH(JC) for the device plus the thermal resistance from the case to the ambient temperature (RTH(CA)). This value of TJ can then be compared to the original, assumed value used in the iterative calculation process. Input Capacitor Choice The input capacitor must have high enough voltage and ripple current ratings to handle the maximum input voltage and RMS ripple current rating. The input ripple current in a boost circuit is very small because the input current is continuous. With 2-phase operation, the ripple cancellation
1.00 0.90 0.80 0.70 3.25 3.00 2.75 2.50 2.25 2.00 1.75 1.50 1.25 1.00 0.75 0.50 0.25 0 0.1
will further reduce the input capacitor ripple current rating. The ripple current is plotted in Figure 5. Please note that the ripple current is normalized against Inorm = VIN L * fs
Output Capacitor Selection The voltage rating of the output capacitor must be greater than the maximum output voltage with sufficient derating. Because the ripple current in output capacitor is a pulsating square wave in a boost circuit, it is important that the ripple current rating of the output capacitor be high enough to deal with this large ripple current. Figure 6 shows the output ripple current in the 1- and 2-phase designs. As we can see, the output ripple current of a 2-phase boost circuit reaches almost zero when the duty cycle equals 50% or the output voltage is twice as much as the input voltage. Thus the 2-phase technique significantly reduces the output capacitor size.
IIN/INORM
0.60 0.50 0.40 0.30 0.20 0.10 0 0 0.2
1-PHASE
2-PHASE
IORIPPLE/IOUT
1-PHASE
0.6 0.4 DUTY CYCLE
0.8
1.0
3782 F04
2-PHASE
Inorm =
VIN L * fs
0.2
0.3 0.4 0.5 0.6 0.7 0.8 DUTY CYCLE OR (1-VIN/VOUT)
0.9
The RMS Ripple Current is About 29% of the Peak-to-Peak Ripple Current. Figure 5. Normalized Input Peak-to-Peak Ripple Current
3782 F05
Figure 6. Normalized Output RMS Ripple Currents in Boost Converter: 1-Phase and 2-Phase. IOUT Is the DC Output Current.
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13
LT3782 APPLICATIONS INFORMATION
For a given VIN and VOUT, we can calculate the duty cycle D and then derive the output RMS ripple current from Figure 6. After choosing output capacitors with sufficient RMS ripple current rating, we also need to consider the ESR requirement if electrolytic caps, tantulum caps, POSCAPs or SP CAPs are selected. Given the required output ripple voltage spec VOUT (in RMS value) and the calculated RMS ripple current IOUT, one can estimate the ESR value of the output capacitor to be ESR VOUT IOUT where L1, L2, etc. are the individual loss components as a percentage of the input power. It is often useful to analyze individual losses to determine what is limiting the efficiency and which change would produce the most improvement. Although all dissipative elements in the circuit produce losses, four main sources usually account for the majority of the losses in LT3782 application circuits: 1. The supply current into VIN. The VIN current is the sum of the DC supply current IQ (given in the Electrical Characteristics) and the MOSFET driver and control currents. The DC supply current into the VIN pin is typically about 7mA and represents a small power loss (much less than 1%) that increases with VIN. The driver current results from switching the gate capacitance of the power MOSFET; this current is typically much larger than the DC current. Each time the MOSFET is switched on and then off, a packet of gate charge QG is transferred from GBIAS to ground. The resulting dQ/dt is a current that must be supplied to the GBIAS capacitor through the VIN pin by an external supply. In normal operation: IQ(TOT) IQ = f * QG PIC = VIN * (IQ + f * QG)
External Regulator to Bias Gate Drivers For applications with VIN higher than 24V, the IC temperature may get too high. To reduce heat, an external regulator between 12V to 14V should be used to override the internal VGBIAS regulator to supply the current needed for BGATE1 and BGATE2 (see Figure 7). Efficiency Considerations The efficiency of a switching regulator is equal to the output power divided by the input power (100%). Percent efficiency can be expressed as: % Efficiency = 100% - (L1 + L2 + L3 + ...),
LT3782
GBIAS GBIAS1 GBIAS2 12V
+
3782 F07
2F
Figure 7
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14
LT3782 APPLICATIONS INFORMATION
2. Power MOSFET switching and conduction losses: IO(MAX) PFET = 2 1- DMAX
2
5. Losses in the boost diode. The power dissipation in the boost diode is: PDIODE = IO(MAX) 2 * VD
* RDS(ON) * DMAX *
T
IO(MAX) + k * VO2 * 2 * CRSS * f 1- DMAX
3. The I2R losses in the sense resistor can be calculated almost by inspection. IO(MAX) PR(SENSE) = 2 1- DMAX
2
The boost diode can be a major source of power loss in a boost converter. For 13.2V input, 42V output at 3A, a Schottky diode with a 0.4V forward voltage would dissipate 600mW, which represents about 1% of the input power. Diode losses can become significant at low output voltages where the forward voltage is a significant percentage of the output voltage. 6. Other losses, including CIN and CO ESR dissipation and inductor core losses, generally account for less than 2% of the total losses. PCB Layout Considerations
* R * DMAX
4. The losses in the inductor are simply the DC input current squared times the winding resistance. Expressing this loss as a function of the output current yields: IO(MAX) PR(WINDING) = 2 1- DMAX
2
* RW
To achieve best performance from an LT3782 circuit, the PC board layout must be carefully done. For lower power applications, a two-layer PC board is sufficient. However, at higher power levels, a multiplayer PC board is recommended. Using a solid ground plane under the circuit is the easiest way to ensure that switching noise does not affect the operation. In order to help dissipate the power from MOSFETs and diodes, keep the ground plane on the layers closest to the layers where power components are mounted. Use power planes for MOSFETs and diodes in order to improve the spreading of the heat from these components into the PCB.
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15
LT3782 APPLICATIONS INFORMATION
For best electrical performance, the LT3782 circuit should be laid out as follows: Place all power components in a tight area. This will minimize the size of high current loops. Orient the input and output capacitors and current sense resistors in a way that minimizes the distance between the pads connected to ground plane. Place the LT3782 and associated components tightly together and next to the section with power components. Use a local via to ground plane for all pads that connect to ground. Use multiple vias for power components. Connect the current sense inputs of LT3782 directly to the current sense resistor pads. Connect the current sense traces on the opposite sides of pads from the traces carrying the MOSFETs source currents to ground. This technique is referred to as Kelvin sensing.
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16
LT3782 TYPICAL APPLICATIONS
10V to 24V Input to 24V, 8A Output Boost Converter
1 2 3 4 5 6 7 10 CS1 10nF 9 59k 82k 10 11 12 10 CS2 10nF 13 14 4.7nF SENSE1- SLOPE RSET SENSE2- SENSE2+ SS BGATE2 VEE2 NC RUN FB VC 20 19 CS2 18 17 16 15 825k 274k Q2 PH3330 8 SGATE2 SGATE1 NC GND SYNC DELAY DCL SENSE1+ LT3782 GBIAS VCC NC NC VEE1 BGATE1 GBIAS1 GBIAS2 28 27 26 25 24 23 22 21 2.2F CIN 22F 25V COUT1 22F, 25V, 4x 0.004 OUTPUT 24V 8A 1F CS1 0.004 10V TO 24V INPUT
*
2R2
L1 PB2020-103 Q1 PH3330
D1 UPS840
COUT2 330F, 35V, 2x
+
*
24.9k 221k
L2 PB2020-103
D2 UPS840
3782 TA02
CC1 RC1 CC2 6.8nF 13.3k 100pF
L1, L2: PULSE PB2020-103 ALL CERAMIC CAPACITORS ARE X7R, TDK *OUTPUT CURRENT WITH BOTH INPUTS PRESENT
Efficiency
100 98 96
EFFICIENCY (%)
15VIN 12VIN
94 92 90 88 86
0
1
2
3
4 5 IOUT (A)
6
7
8
3782 TA02b
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17
LT3782 PACKAGE DESCRIPTION
FE Package 28-Lead Plastic TSSOP (4.4mm)
(Reference LTC DWG # 05-08-1663)
Exposed Pad Variation EB
4.75 (.187)
9.60 - 9.80* (.378 - .386) 4.75 (.187) 28 2726 25 24 23 22 21 20 19 18 1716 15
6.60 0.10 4.50 0.10
SEE NOTE 4
2.74 (.108) 0.45 0.05
EXPOSED PAD HEAT SINK ON BOTTOM OF PACKAGE
6.40 2.74 (.252) (.108) BSC
1.05 0.10 0.65 BSC
RECOMMENDED SOLDER PAD LAYOUT
1 2 3 4 5 6 7 8 9 10 11 12 13 14 1.20 (.047) MAX
0 - 8
4.30 - 4.50* (.169 - .177)
0.25 REF
0.09 - 0.20 (.0035 - .0079)
0.50 - 0.75 (.020 - .030)
0.65 (.0256) BSC
0.195 - 0.30 (.0077 - .0118) TYP
0.05 - 0.15 (.002 - .006)
FE28 (EB) TSSOP 0204
NOTE: 1. CONTROLLING DIMENSION: MILLIMETERS 2. DIMENSIONS ARE IN MILLIMETERS (INCHES) 3. DRAWING NOT TO SCALE
4. RECOMMENDED MINIMUM PCB METAL SIZE FOR EXPOSED PAD ATTACHMENT *DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH SHALL NOT EXCEED 0.150mm (.006") PER SIDE
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18
LT3782 PACKAGE DESCRIPTION
UFD Package 28-Lead Plastic QFN (4mm x 5mm)
(Reference LTC DWG # 05-08-1712 Rev B)
0.70 0.05
4.50 0.05 3.10 0.05 2.50 REF 2.65 0.05 3.65 0.05
PACKAGE OUTLINE
0.25 0.05 0.50 BSC 3.50 REF 4.10 0.05 5.50 0.05 RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED 4.00 0.10 (2 SIDES) 0.75 0.05 R = 0.05 TYP PIN 1 NOTCH R = 0.20 OR 0.35 x 45 CHAMFER 27 28 0.40 0.10 1 2 5.00 0.10 (2 SIDES)
2.50 REF R = 0.115 TYP
PIN 1 TOP MARK (NOTE 6)
3.50 REF 3.65 0.10 2.65 0.10
(UFD28) QFN 0506 REV B
0.200 REF 0.00 - 0.05
0.25 0.05 0.50 BSC BOTTOM VIEW--EXPOSED PAD
NOTE: 1. DRAWING PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220 VARIATION (WXXX-X). 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE 5. EXPOSED PAD SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE
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Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
19
LT3782 TYPICAL APPLICATIONS
28V Output Base Station Power Converter with Redundant Input
1 2 3 4 5 6 7 10 CS1 10nF 9 59k 82k 10 11 12 10 CS2 10nF 13 14 4.7nF RC1 CC2 15k 100pF SENSE1- SLOPE RSET SENSE2- SENSE2+ SS BGATE2 VEE2 NC RUN FB VC 20 0.004 19 18 17 16 15 825k 274k CINB 22F CS2 Q2 PH4840S 8 SGATE2 SGATE1 NC GND SYNC DELAY DCL SENSE1+ LT3782 GBIAS VCC NC NC VEE1 BGATE1 GBIAS1 GBIAS2 28 27 26 25 24 23 22 21 2.2F COUT1 10F, 50V, 4x OUTPUT 28V 4A (8A**) 1F CINA 22F CS1 0.004 2R2 BAS516 VINA 0V TO 28V*
*
L1 10H Q1 PH4840S D1 UPS840 COUT2 330F, 35V, 2x
+
*
24.9k 261k
BAS516
L2 10H
D2 UPS840
3782 TA03
CC1 4.7nF
NOTE: VINB 0V TO 28V* *INPUT VOLTAGE RANGE FOR VINA AND VINB IS 0V TO 28V. AT LEAST ONE OF THE INPUTS MUST BE 12V OR HIGHER. L1, L2: PULSE PB2020-103 ALL CERAMIC CAPACITORS ARE X7R, TDK **OUTPUT CURRENT WITH BOTH INPUTS 12V OR HIGHER
RELATED PARTS
PART NUMBER LT 1619
(R)
DESCRIPTION Current Mode PWM Controller Current Mode DC/DC Controller Overvoltage Protection Controller No RSENSETM Synchronous Step-Up Controller Wide Input Range Controller 1.2MHz, SOT-23 Boost Converter Single Switch Synchronous Forward Controller 5A, 8MHz 4-Phase Monolithic Step-Up DC/DC Converter 100V and 60V, Step-Down and Step-Up DC/DC Synchronous Controller Dual, 550kHz, 2-Phase Synchronous Step-Down Controller
COMMENTS 300kHz Fixed Frequency, Boost, SEPIC, Flyback Topology SO-8; 300kHz Operating Frequency; Buck, Boost, SEPIC Design; VIN Up to 36V 0.8V VIN 24V, 2% Overvoltage Threshold Accuracy, ThinSOTTM Package Up to 95% Efficiency, Operation as Low as 0.9V Input No RSENSE, 7V Gate Drive, Current Mode Control Up to 34V Output, 2.6V VIN 16V, Miniature Design High Efficiency, 25W to 500W, Wide Input Range, Adaptive Duty Cycle Clamp 0.5V VIN 4.5V, 2.4V VOUT 5.25V, Very Low Output Ripple High Efficiency Synchronous Operation, High Voltage Operation, No Transformer Required Dual 180 Phased Controllers, VIN: 3.5V to 35V, 99% Duty Cycle, 5mm x 5mm QFN, SSOP-28 Packages
LTC1624 LTC1696 LTC1700 LTC1871/LTC1871-7 LT1930 LT1952 LTC3425 LTC3703/LTC3703-5 LTC3728 LTC3729 LTC3731 LTC3803 LTC3806
20A to 200A, 550kHz PolyPhaseTM Synchronous Expandable from 2-Phase to 12-Phase, Uses All Surface Mount Components, Controller VIN Up to 36V 3- to 12-Phase Step-Down Synchronous Controller SOT-23 Flyback Controller Synchronous Flyback Controller 60A to 240A Output Current, 0.6V VOUT 6V, 4.5V VIN 32V Adjustable Slope Compensation, Internal Soft-Start, Current Mode 200kHz Operation High Efficiency, Improves Cross Regulation in Multiple Output Designs, Current Mode, 3mm x 4mm 12-Pin DFN Package
3782ff
PolyPhase is a registered trademark of Linear Technology Corporation. ThinSOT and No RSENSE are trademarks of Linear Technology Corporation.
20 Linear Technology Corporation
(408) 432-1900 FAX: (408) 434-0507
LT 1008 REV F * PRINTED IN USA
1630 McCarthy Blvd., Milpitas, CA 95035-7417
www.linear.com
(c) LINEAR TECHNOLOGY CORPORATION 2007

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